AG-029

Name: AG-029
Brand: AG TERMOPASTY
SKU: 100.455.05
Availability: InStock

Two-component silicone potting compound, 100:10 mixing ratio, -50...+200°C, 100g

The product is a liquid encapsulating compound, two-component, thermally conductive. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch. It cures in 24 hours at room temperature. To be mixed in a ratio of 100:10. After mixing, it can be used for 30-40 minutes.

Manufacturer	AG TERMOPASTY
Colour	grey
Weight	100g
Operating temperature	-50...180°C
Application	sealing and encapsulation of electronic circuits
Type of chemical agent	silicone encapsulating compound
Application	sealing and encapsulation of electronic circuits
Agent features	two-component, additive linking
Bonding time	40 minute
Density	1.8g/cm3 @ 25°C
Mix ratio	100:10

Extended distributor/manufacturer information (EU Regulation 2023/988)

Trade name: AG TermoPasty
Postal address: Kolejowa 33E, 18-218 Sokoły, Poland
Electronic address: https://termopasty.com/

Part.No: 100.455.05

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Quantity (pcs):

Unit price excl. VAT

1+	5 469 Ft
5+	5 181 Ft
10+	5 073 Ft
20+	4 976 Ft
50+	4 838 Ft

* The prices according to your settings are displayed without VAT, that contains your custom discount if available, without shipping costs. For modify please click

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Availability	Qu.
3 workdays	> 5

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